Biggest Threats to your Semiconductor Cleanroom

Maintaining a cleanroom environment is critical for effective semiconductor manufacturing. As a supporting entity to our clients/partners on semiconductor cleanroom projects, we will use this blog to explore a list of threats that may interfere with effective semiconductor cleanroom maintenance, and how to mitigate these threats effectively.

 

1.   Contamination Control

Semiconductor cleanrooms are highly sensitive to particulate contamination. Even the smallest particles, such as dust, skin cells, and microbes, can cause defects in semiconductor wafers, leading to product failures and significant yield losses. All our panels comply with the standards of all ISO classifications (1-8),  we have a range of non-shedding panels (which reduces the release of particles into the cleanroom), and we offer a fully flush system which greatly minimises areas where contaminants can accumulate.

 

Solutions:

•   HEPA Filters: Install high-efficiency particulate air (HEPA) filters to continuously remove particles from the air.
•   Proper Gowning Procedures: Ensure all personnel follow strict gowning protocols, including wearing appropriate cleanroom attire to minimise contamination from skin and clothing.
•   Air Showers: Use air showers at entry points to blow off contaminants from personnel before they enter the cleanroom.
•   Regular Cleaning: Implement a rigorous cleaning schedule to keep surfaces free from dust and particles.

 

2.   Temperature and Humidity Control

Fluctuations in temperature and humidity can have severe effects on semiconductor manufacturing. Inconsistent environmental conditions can lead to condensation, static buildup, and material degradation, impacting product quality and reliability. Our mineral fibre insulating core and a fully sealed panel system alongside well-sealed doors will insulate the cleanroom and minimise changes in temperature and humidity. Our honeycomb system was tested under positive and negative pressure up to 500 pascals and was in accordance with the most stringent global standards (contact us for more detail).

 

Solutions:

•   HVAC Systems: Invest in dedicated heating, ventilation, and air conditioning (HVAC) systems designed specifically for cleanrooms to maintain stable temperature and humidity levels.
•   Continuous Monitoring: Use advanced monitoring systems to track environmental conditions in real-time, allowing for immediate corrective actions when deviations occur.
•   Sealed Environments: Ensure that the cleanroom is well-sealed to prevent external air from disrupting the controlled environment.

 

3.   Electrostatic Discharge (ESD)

ESD is a significant threat in semiconductor cleanrooms as it can damage sensitive electronic components. Static electricity generated by human activity, equipment, and materials can lead to catastrophic failures in semiconductor devices. Some electronic parts can be destroyed or damaged by ESD as low as 20 volts. Gilcrests systems has been tested up to 500 pascals, and our range of anti-static or static dissipative finishes allows for a safer environment to manufacture semiconductors and microelectronics and avoid static damage and consequently, a lower production defect rate.

 

Solutions:

•   Antistatic Materials: Use antistatic flooring, work surfaces, and tools to minimise static generation.
•   Proper Grounding: Ensure all equipment and personnel are properly grounded to safely dissipate static charges.
•   Conductive Materials: Implement conductive materials in cleanroom construction to allow electrons to flow away safely, reducing the buildup of static charges.
•   Training Programs: Educate personnel on ESD prevention techniques and the importance of maintaining static-free environments.

 

4.   Outgassing

Outgassing, the release of trapped gases from materials and equipment, can contaminate the cleanroom environment and interfere with semiconductor manufacturing processes. This can lead to defects and reduce product quality. Gilcrests panel finish has been tested by Seagate (2022) and passed the outgassing test, and our honeycomb panels have perforations that allow gases to exit the panel without causing bubbles to appear. 

 

Solutions:

•   Material Selection: Choose materials known for low outgassing properties to construct cleanroom components and equipment.
•   Regular Maintenance: Perform regular maintenance on all equipment to minimise outgassing.
•   Effective Filtration: Use powerful HVAC and filtration systems to continuously circulate and filter the air, removing any outgassed contaminants quickly.
•   Equipment Testing: Regularly test equipment for outgassing and replacing or repairing any items that pose a risk.

 

5.   External Factors

Maintaining cleanroom integrity in the face of external factors such as building vibrations, electromagnetic interference (EMI), and fluctuating utility supplies can be demanding. These factors can disrupt sensitive manufacturing processes and compromise product quality.

 

Solutions:

•   Vibration Isolation: Implement vibration isolation techniques in cleanroom design and use vibration-dampening materials for equipment.
•   EMI Shielding: Use EMI shielding materials and grounding techniques to protect sensitive equipment from electromagnetic interference.
•   Stable Utility Supplies: Ensure a stable and reliable supply of utilities, including power and water, and consider using uninterruptible power supplies (UPS) to protect against fluctuations.

 

Conclusion

Understanding and mitigating threats to semiconductor cleanrooms is crucial for maintaining their integrity. As we support our clients and partners in the semiconductor industry, we continue to supply products and solutions to protect against these threats. By implementing stringent contamination controls, stable environmental conditions, robust ESD measures, effective outgassing management, and protections against external factors, manufacturers can ensure high-quality semiconductor production. Visit our website today to explore our Puracore range of semiconductor-suitable products.